We look forward to meeting you at Embedded World Exhibition&Conference from March 10 to 12, 2026 in Nuremberg, Germany!
📅 Save the date and meet us in Nuremberg!
New Online Shop
In case you did not notice, yet: Our new shop is online now. All SoMs, baseboards and accessories are available for immediate purchase. Feel free to pay a visit under https://shop.aries-embedded.de/
Edison Replacement
Android Things adds i.MX7Dual and Google Voice Assistant support
Recently, as part of Google’s next Developer Preview release of Android Things, a new Board Support Package will be added for the Pico board powered by the NXP i.MX 7Dual applications processor.
Additionally, this latest release will include support for the Google Assistant SDK enabling developers to embed the Google Assistant voice services within their devices based on the i.MX7Dual.
MCVEVP in the News
A nice introducution on our recently introduced MCVEVP by Elektronik Praxis can be found here. MCVEVP is the ideal platform for fast prototyping, the Time-to-Market can be reduced significantly.
MCVEVP offers
- 2x Gigabit Ethernet
- USB
- UART
- CAN
- TFT connector with Touchscreen
- Touchscreen controller I²C
- HSMC extension connector
- 3x PMOD extension connectors
and much more...
www.aries-embedded.de
News & Events
Stay tuned to the latest News and Events:
A brief introduction to the new MSRZV2H, based on Renesas Electronics extremely powerful 💪 RZ/V2H architecture:
- powerful CPU complex
- OSM compliant SoM, size L 45x45 mm² 📍
- connect one camera 📷 to the SoM when being OSM-compliant, connect up to four cameras simultaneously as an option
- AI 🎛️ Accelerator DRP-AI3 (8TOPS…
Featured Products
Choose your SoM, Evaluation Kit & more:
MRZV2LSEVK - Evaluation Kit for RZ/V2L
Your Easy Start into Edge AI-applications
MSRZG3S - Cortex-A55/Cortex-M33
RZ/G3S Smallest SoM Gateway Solution
MSIX93EVK - Evaluate the i.MX93 OSM SoM
Power Efficient and AI capable
Embedded World 2017
Many thanks for joining us in Nuremberg.
Integrated wireless with long-term availability
ARIES Embedded presents the new product based on the Qualcomm® Snapdragon™ 410E processor in the TX embedded module family. The TX embedded module integrates all the core components of a common PC and is mounted onto an application specific carrier board. TX modules have specified pinouts and provide the functional requirements for an embedded application. These functions include, but are not limited to, graphics, network and multiple USB ports. A single ruggedized SO-DIMM connector provides the carrier board interface to carry all the I/O signals to and from the TX module.
PICO-i.MX6UL for Android Things
As Google unveils its Android Things platform, the Android Things-compatible IoT development platform PICO-IMX6UL-KIT, based on the HOBBIT-board and the PICO-i.MX6UL SoM, was introduced to the market. The new Android Things Google software combined with the smart PICO-i.MX6UL SoM will accelerate product development, help companies better predict development costs, and provide Google-managed security for emerging products.