MSMP1EVK - STMP1 Evaluation Kit

Easy Start and Integration of the MSMP1 SiP

The MSMP1EVK supports a quick start-up of CPU projects and can easily be used as a fast-prototype platform.

The MSMP1EVK contains the Open Standard Module compliant System-In-Package based on ST Microelectronics STMP1 Family architecture offering high-performance single/dual CortexA7 cores in combination with a CortexM4 core. The MSMP1 combines compact design and a wide range of services, bringing low power consumption, thermal efficiency and low-cost to embedded systems.

  • Ethernet 10/100MBit on RJ45
  • Camera Port
  • LCD Interface
  • Dual UART on DSUB9
  • Dual CAN on DSUB9
  • USB Host
  • USB Host/OTG
  • microSD card slot
  • JTAG
  • size 165mm x 135mm

MSMP157EVK-AAE

  • MSMP1 SiP
    • STM32MP157
    • 512MB LPDDR3 RAM
    • 4GB eMMC
    • -25...+85°C
  • Ethernet 10/100MBit on RJ45
  • Camera Port
  • LCD Interface
  • Dual UART on DSUB9
  • Dual CAN on DSUB9
  • USB Host
  • USB Host/OTG
  • microSD card slot
  • JTAG

The idea of all Open Standard Modules is to create a new, future proof and versatile standard for small-size, low-cost embedded computer modules, combining the following key characteristics:

  • Completely machine processible during soldering, assembly and testing
  • different possible packages for direct PCB soldering without connector
  • Pre-defined soft- and hardware interfaces
  • Open-Source in soft- and hardware

The Open Standard Module specification allows developing, producing and distributing embedded modules for the most popular MCU32, ARM and RSICV architectures. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding costs, space and interfaces.

Easy Start and Integration of the MSMP1 SiP