MSMP1EVK - STMP1 Evaluation Kit

Easy Start and Integration of the MSMP1 SiP

The MSMP1EVK supports a quick start-up of CPU projects and can easily be used as a fast-prototype platform.

The MSMP1EVK contains the Open Standard Module compliant System-In-Package based on ST Microelectronics STMP1 Family architecture offering high-performance single/dual CortexA7 cores in combination with a CortexM4 core. The MSMP1 combines compact design and a wide range of services, bringing low power consumption, thermal efficiency and low-cost to embedded systems.

  • MSMP1 System on Module
  • Ethernet on RJ45 connector
  • USB Host on USB A connector
  • USB OTG interface on USB microAB connector
  • display on FPC connector or pin header
  • console interface on USB microAB connector
  • UART on pin header
  • CAN on pin header
  • SPI on pin header
  • I2C on pin header
  • GPIO on pin header
  • JTAG on pin header

 

MSMP157EVK-BAA

  • MSMP1 SiP
    • STM32MP157
    • 1GByte LPDDR3 RAM
    • 4GB eMMC
    • -25...+85°C
  • Ethernet on RJ45 connector
  • USB Host on USB A connector
  • USB OTG interface on USB microAB connector
  • display on FPC connector or pin header
  • console interface on USB microAB connector
  • UART on pin header
  • CAN on pin header
  • SPI on pin header
  • I2C on pin header
  • GPIO on pin header
  • JTAG on pin header

The idea of all Open Standard Modules is to create a new, future proof and versatile standard for small-size, low-cost embedded computer modules, combining the following key characteristics:

  • Completely machine processible during soldering, assembly and testing
  • different possible packages for direct PCB soldering without connector
  • Pre-defined soft- and hardware interfaces
  • Open-Source in soft- and hardware

The Open Standard Module specification allows developing, producing and distributing embedded modules for the most popular MCU32, ARM and RSICV architectures. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding costs, space and interfaces.

Easy Start and Integration of the MSMP1 SiP