The MSRZG3E is the Open Standard Module compliant System-In-Package based on Renesas RZ/G3E Family architecture. The SoM is offering high-performance dual/quad CortexA55 cores in combination with a CortexM33 core. The MSRZG3E combines compact design and a wide range of functions, bringing reasonably low power consumption, thermal efficiency and low-cost to embedded systems.

The MSRZG3E general-purpose microprocessor units (MPUs) are built around two or four CortexA55 CPU cores which are combined with a CortexM33 CPU core and an optional Ethos-U55 NPU. Peripheral functions include support for multiple interfaces, such as dual Gigabit Ethernet channels, one PCI Express interface, one USB3.2 host channel, two USB 2.0 channels, and two CAN channels, as well as A/D converter modules, making it ideal for applications such as HMI systems and advanced smart vision systems. The chosen OSM form factor supports 476 contacts, offers almost all of the CPU functionality on the contacts and is therefore suitable for most industrial applications.

On demand custom processor-, temperature- and memory-configurations are available. Also custom SoM derivatives, adding special interfaces, or a custom board implementation in a different size or geometry can be offered.