MSIX93 - Dual Core size-S OSM
For Energie efficient Computing

On only 30x30mm² size the MSIX93 offers maximum performance with minimum power requirements for applications, where real embedded products are needed. Based on the i.MX93 CPU by NXP it is the ideal solution for diverse market with high quantity requirements.
The i.MX 93 applications processors are the first in the i.MX portfolio to integrate the scalable Arm Cortex-A55 core, bringing performance and energy efficiency to Linux®-based edge applications and the Arm Ethos™-U65 microNPU, enabling developers to create more capable, cost-effective and energy-efficient ML applications.
Optimizing performance and power efficiency for Industrial, IoT and automotive devices, i.MX 93 processors are built with NXP’s innovative Energy Flex architecture. The SoCs offer a rich set of peripherals targeting automotive, industrial and consumer IoT market segments.
Features
- i.MX93 CPU
- single/dual Cortex-A55, up to 1.7GHz
- Cortex-M33, up to 250MHz
- Arm Ethos-U65 micro NPU, optional
- 256MB – 2GB LPDDR4 RAM
- 4GB – 64GB eMMC NAND Flash
- 2MBit - 512MBit SPI NOR
- Dual 10/100/1000MBit Ethernet
- USB2.0 Host
- USB2.0 device
- 2x CANFD
- UART, I2C, SPI, ADC
- Hardware Compositor for Blending/Composition, Resize, Color Space Conversion
- LVDS display interface 720p
- MIPI-CSI camera interface 2 lanes
- compliant to the SGET OSM standard
- sizeS, 30x30mm
- 332 contacts
- 0°C..+70°C commercial temperature range
- -40°C..+85°C industrial temperature range
Block Diagram

Pictures

Order Codes
MSIX93-6CBA
- NXP i.X93 CPU MIMX9352CVVXMAB
- 1GB LPDDR4 RAM
- 8GB eMMC NAND Flash
- 128MBit SPI-NOR
- 0°...+70°C
OSM Standard |
![]() |
The idea of all Open Standard Modules (OSM) is to create a new, future proof and versatile standard for small-size, low-cost embedded computer modules, combining the following key characteristics:
- different architectures available on the same footprint, scalability in function and performance
- four different mechanical sizes and pin counts, downwards compatible
- pre-defined soft- and hardware interfaces
- specification and design guide publicly available
- design support for baseboard integration, driver development and mass production by ARIES Embedded
- directly assembly to the baseboard without connectors using LGA (Land Grid Array) technology
- completely machine processible during soldering, assembly and testing
The Open Standard Module specification allows developing, producing and distributing embedded modules for the most popular MCU32, ARM and RSICV architectures. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding costs, space and interfaces.