MSMP1 - Low Power Mid-Range SiP

STMP1 Microprocessor SiP for IoT Applications


The MSMP1 is the Open Standard Module compliant System-In-Package based on ST Microelectronics STMP1 Family architecture offering high-performance single/dual CortexA7 cores in combination with a CortexM4 core. The MSMP1 combines compact design and a wide range of services, bringing low power consumption, thermal efficiency and low-cost to embedded systems.

The STMP1 general-purpose microprocessor units (MPUs) are built around two CortexA7 CPU cores. Peripheral functions include support for multiple interfaces, such as Gigabit Ethernet channels, two USB 2.0 channels, and two CAN channels, as well as A/D converter modules, making it ideal for applications such as entry-class social infrastructure gateway control and industrial gateway control. The chosen OSM form factor supports 476 contacts, offers almost all of the CPU functionality on the contacts and is therefore suitable for most industrial applications.

In addition to a wide range of services, the MSMP1 modules also offer new functionalities in terms of flexibility and processing. The OSM Systems-in-Packages can be individually adapted to the respective customer requirements due to four different form factors.

 

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The idea of all Open Standard Modules is to create a new, future proof and versatile standard for small-size, low-cost embedded computer modules, combining the following key characteristics:

  • Completely machine processible during soldering, assembly and testing
  • different possible packages for direct PCB soldering without connector
  • Pre-defined soft- and hardware interfaces
  • Open-Source in soft- and hardware

The Open Standard Module specification allows developing, producing and distributing embedded modules for the most popular MCU32, ARM and RSICV architectures. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding costs, space and interfaces.