MSRZG3EEVK - RZ/G3E Evaluation Kit

Easy Start and Integration of the MSRZG3E SiP

The MSRZG3EEVK supports a quick start-up of CPU projects and can easily be used as a fast-prototype platform.

The MSRZG3EEVK contains the Open Standard Module compliant System-In-Package based on Renesas' RZ/G3E Family architecture offering high-performance dual/quad CortexA55 cores in combination with a CortexM33 core. The MSRZG3E combines compact design and a wide range of services, bringing low power consumption, thermal efficiency and low-cost to embedded systems.

  • MSRZG3E System on Module
  • Ethernet on RJ45 connector
  • USB Host on USB A connector
  • USB OTG interface on USB microAB connector
  • display on FPC connector or pin header
  • console interface on USB microAB connector
  • UART on pin header
  • CAN on pin header
  • SPI on pin header
  • I2C on pin header
  • GPIO on pin header
  • JTAG on pin header

MSRZG3EEVK-4CBA

  • MSRZG3E-4CBA SiP
    • R9A09G047E57GBG CPU
      • Ethos-U55   
      • 4x Cortex-A55, up to 1.8GHz
      • 1x Cortex-M33, up to 200MHz
    • 2GB LPDDR4 RAM
    • 8GB eMMC NAND flash
    • 128MBit SPI NOR
    • -25°C...+70°C
  • Ethernet on RJ45 connector
  • USB Host on USB A connector
  • USB OTG interface on USB microAB connector
  • display on FPC connector or pin header
  • console interface on USB microAB connector
  • UART on pin header
  • CAN on pin header
  • SPI on pin header
  • I2C on pin header
  • GPIO on pin header
  • JTAG on pin header

OSM Standard          

OSM Standard

The idea of all Open Standard Modules (OSM) is to create a new, future proof and versatile standard for small-size, low-cost embedded computer modules, combining the following key characteristics:

  • different architectures available on the same footprint, scalability in function and performance
  • four different mechanical sizes and pin counts, downwards compatible
  • pre-defined soft- and hardware interfaces
  • specification and design guide publicly available
  • design support for baseboard integration, driver development and mass production by ARIES Embedded
  • directly assembly to the baseboard without connectors using LGA (Land Grid Array) technology
  • completely machine processible during soldering, assembly and testing

The Open Standard Module specification allows developing, producing and distributing embedded modules for the most popular MCU32, ARM and RSICV architectures. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding costs, space and interfaces.

Easy Start and Integration of the MSRZG3E SiP