MSRZV2H - Driving AI Applications

OSM Size L SoM supporting four Cameras

The MSRZV2H is the Open Standard Module compliant System-In-Package based on Renesas RZ/V2H Family architecture. The SoM is offering high-performance quad CortexA55 cores in combination with dual CortexR9 and a CortexM33 core. The MSRZV2H combines compact design and a wide range of functions, bringing reasonably low power consumption, thermal efficiency and low-cost to embedded systems. 

The MSRZV2H general-purpose microprocessor units (MPUs) are built around two or four CortexA55 CPU cores which are combined with a dual CortexR9 and a CortexM33 CPU core and an DRP AI co-processor/accelerator. Peripheral functions include support for multiple interfaces, such as dual Gigabit Ethernet channels, one PCI Express interface, USB3.2 host channels, two USB 2.0 channels, and two CANFD channels, as well as PWM modules, making it ideal for applications such as advanced smart vision systems, drones and surveillance systems. The chosen OSM form factor supports 662 contacts, offers almost all of the CPU functionality on the contacts and is therefore suitable for most industrial applications.

On demand custom processor-, temperature- and memory-configurations are available. Also custom SoM derivatives, adding special interfaces, or a custom board implementation in a different size or geometry can be offered.

  • Quad Cortex-A55, up to 1.8GHz
  • Dual Cortex-R8, up to 800MHz
  • Cortex-M33, up to 200MHz
  • DRP AI-co-processor and DRP-AI accelerator
  • 1GB – 16GB LPDDR4 RAM
  • 8GB – 128GB eMMC NAND Flash
  • MIPI-DSI
  • four MIPI-CSI camera interface, 1, 2 or 4 lanes
  • Video Codec Unit, H.264/H.265 encoding / decoding
  • Mali-G3 GPU
  • PCIe, 1 port Gen3 x2
  • Dual 10/100/1000MBit Ethernet
  • USB2.0 Host/OTG
  • 2x USB3.2 Host
  • 2x CANFD
  • UART, I2C, SPI, ADC, DAC
  • compliant to the SGET OSM standard
  • sizeM, 45x45mm, 662 contacts
  • 0°C..+70°C commercial temperature range
  • -40°C..+85°C industrial temperature range

MSRZV2H-6DCA

  • R9A09G057H48GBG RZ/V2H processor
    • 4x Cortex-A55, up to 1.8GHz
    • 2x Cortex-R9, up to 800MHz
    • 1x Cortex-M33, up to 200MHz
    • DRP AI-coprocessor
    • Security
    • ISP
  • 8GByte LPDDR4 RAM
  • 32GByte eMMC NAND Flash
  • 128Mbit SPI NOR
  • temeprature range 0°C...+70°C

OSM Standard          

OSM Standard

The idea of all Open Standard Modules (OSM) is to create a new, future proof and versatile standard for small-size, low-cost embedded computer modules, combining the following key characteristics:

  • different architectures available on the same footprint, scalability in function and performance
  • four different mechanical sizes and pin counts, downwards compatible
  • pre-defined soft- and hardware interfaces
  • specification and design guide publicly available
  • design support for baseboard integration, driver development and mass production by ARIES Embedded
  • directly assembly to the baseboard without connectors using LGA (Land Grid Array) technology
  • completely machine processible during soldering, assembly and testing

The Open Standard Module specification allows developing, producing and distributing embedded modules for the most popular MCU32, ARM and RSICV architectures. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding costs, space and interfaces.

OSM Size L SoM supporting four Cameras