MSRZG2UL - Cortex-A55/Cortex-M33

RZ/G2UL OSM compliant System-In-Package

The MSRZG2UL is the Open Standard Module compliant System-In-Package based on Renesas RZ Family architecture offering high-performance Cortex-A55/Cortex-M33 core. The MSRZG2UL combines compact design and a wide range of services, bringing low power consumption, thermal efficiency and low-cost to embedded systems.

The RZ/G2UL general-purpose microprocessor units (MPUs) are built around a Cortex-A55/Cortex-M33 CPU core. Peripheral functions include support for multiple interfaces, such as two USB 2.0 channels, Camera interface (MIPI-CSI), Gigabit Ethernet channel, two SD channels, and CAN channel, as well as dDisplay interface (Parallerl-IF), making it ideal for applications such as entry-class industrial gateway control and embedded devices with Simple GUI capabilities.

In addition to a wide range of services, the MSRZG2UL module also offers new functionalities in terms of flexibility and processing. The OSM Systems-in-Packages can be individually adapted to the respective customer requirements due to four different form factors.

    • Single Cortex-A55, up to 1GHz
    • Cortex-M33, up to 200MHz
    • 512MB – 4GB DDR4 RAM
    • 4GB eMMC NAND Flash
    • dual 10/100/1000MBit Ethernet
    • USB2.0 Host/OTG
    • 2x CAN
    • UART, I2C, SPI
    • ADC
    • parallel display interface
    • MIPI-CSI camera interface
    • compliant to the SGET OSM standard
    • size S, 30x30mm²
    • pin count: 332
    • 0°C..+70°C commercial temperature range
    • -40°C..+85°C industrial temperature range


    • Renesas RZ/G2UL R9A07G043U11GBG
    • 512MB DDR4 RAM
    • no eMMC NAND Flash
    • 128MBit SPI-NOR
    • -25°...+85°C



    • Renesas RZ/G2UL R9A07G043U11GBG
    • 1GB DDR4 RAM
    • 4GB eMMC
    • 128MBit SPI-NOR
    • -25°...+85°C




    OSM Standard          

    OSM Standard

    The idea of all Open Standard Modules (OSM) is to create a new, future proof and versatile standard for small-size, low-cost embedded computer modules, combining the following key characteristics:

    • different architectures available on the same footprint, scalability in function and performance
    • four different mechanical sizes and pin counts, downwards compatible
    • pre-defined soft- and hardware interfaces
    • specification and design guide publicly available
    • design support for baseboard integration, driver development and mass production by ARIES Embedded
    • directly assembly to the baseboard without connectors using LGA (Land Grid Array) technology
    • completely machine processible during soldering, assembly and testing

    The Open Standard Module specification allows developing, producing and distributing embedded modules for the most popular MCU32, ARM and RSICV architectures. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding costs, space and interfaces.

    RZ/G2UL OSM compliant System-In-Package