MSRZFive - RISC-V Single Core SiP

RZ/Five OSM compliant System-In-Package

The MSRZFive is the Open Standard Module compliant System-In-Package based on Renesas RZ Family architecture offering high-performance 64-bit RISC-V core. The MSRZFive combines compact design and a wide range of services, bringing low power consumption, thermal efficiency and low-cost to embedded systems.

The RZ/Five general-purpose microprocessor units (MPUs) are built around a 64-bit RISC-V CPU core and employ the Andes AX45MP, based on the RISC-V CPU instruction set architecture (ISA). Peripheral functions include support for multiple interfaces, such as two Gigabit Ethernet channels, two USB 2.0 channels, and two CAN channels, as well as dual A/D converter modules, making it ideal for applications such as entry-class social infrastructure gateway control and industrial gateway control.

In addition to a wide range of services, the MSRZFive modules also offer new functionalities in terms of flexibility and processing. The OSM Systems-in-Packages can be individually adapted to the respective customer requirements due to four different form factors.


    • Single core RISC-V, up to 1GHz
    • 512MB – 4GB DDR4 RAM
    • 4GB eMMC NAND Flash
    • dual 10/100/1000MBit Ethernet
    • USB2.0 Host/OTG
    • 2x CAN
    • UART, I2C, SPI
    • ADC
    • compliant to the SGET OSM standard
    • size S, 30x30mm²,
    • pin count: 332
    • 0°C..+70°C commercial temperature range
    • -40°C..+85°C industrial temperature range


    • Renesas RZFive R9A07G043F01GBG
    • 512MB DDR4 RAM
    • no eMMC NAND Flash
    • 128MBit SPI-NOR
    • -25°...+85°C


    OSM Standard          

    OSM Standard

    The idea of all Open Standard Modules (OSM) is to create a new, future proof and versatile standard for small-size, low-cost embedded computer modules, combining the following key characteristics:

    • different architectures available on the same footprint, scalability in function and performance
    • four different mechanical sizes and pin counts, downwards compatible
    • pre-defined soft- and hardware interfaces
    • specification and design guide publicly available
    • design support for baseboard integration, driver development and mass production by ARIES Embedded
    • directly assembly to the baseboard without connectors using LGA (Land Grid Array) technology
    • completely machine processible during soldering, assembly and testing

    The Open Standard Module specification allows developing, producing and distributing embedded modules for the most popular MCU32, ARM and RSICV architectures. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding costs, space and interfaces.

    RZ/Five OSM compliant System-In-Package