MSRZFive - RISC-V Single Core SiP
RZ/Five OSM compliant System-In-Package
The MSRZFive is the Open Standard Module compliant System-In-Package based on Renesas RZ Family architecture offering high-performance 64-bit RISC-V core. The MSRZFive combines compact design and a wide range of services, bringing low power consumption, thermal efficiency and low-cost to embedded systems.
The RZ/Five general-purpose microprocessor units (MPUs) are built around a 64-bit RISC-V CPU core and employ the Andes AX45MP, based on the RISC-V CPU instruction set architecture (ISA). Peripheral functions include support for multiple interfaces, such as two Gigabit Ethernet channels, two USB 2.0 channels, and two CAN channels, as well as dual A/D converter modules, making it ideal for applications such as entry-class social infrastructure gateway control and industrial gateway control.
In addition to a wide range of services, the MSRZFive modules also offer new functionalities in terms of flexibility and processing. The OSM Systems-in-Packages can be individually adapted to the respective customer requirements due to four different form factors.
Features
- Single core RISC-V, up to 1GHz
- 512MB – 4GB DDR4 RAM
- 4GB eMMC NAND Flash
- dual 10/100/1000MBit Ethernet
- USB2.0 Host/OTG
- 2x CAN
- UART, I2C, SPI
- ADC
- compliant to the SGET OSM standard
- size S, 30x30mm²,
- pin count: 332
- 0°C..+70°C commercial temperature range
- -40°C..+85°C industrial temperature range
Block Diagram
Pictures
Order Codes
MSRZFive-A0A
- Renesas RZFive R9A07G043F01GBG
- 512MB DDR4 RAM
- no eMMC NAND Flash
- 128MBit SPI-NOR
- -25°...+85°C
OSM Standard |
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The idea of all Open Standard Modules (OSM) is to create a new, future proof and versatile standard for small-size, low-cost embedded computer modules, combining the following key characteristics:
- different architectures available on the same footprint, scalability in function and performance
- four different mechanical sizes and pin counts, downwards compatible
- pre-defined soft- and hardware interfaces
- specification and design guide publicly available
- design support for baseboard integration, driver development and mass production by ARIES Embedded
- directly assembly to the baseboard without connectors using LGA (Land Grid Array) technology
- completely machine processible during soldering, assembly and testing
The Open Standard Module specification allows developing, producing and distributing embedded modules for the most popular MCU32, ARM and RSICV architectures. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding costs, space and interfaces.