V2HBerry - RZ/V2H Evaluation Kit

Complex AI Applications on a Single Board

The V2HBerry supports a quick start-up of CPU projects and can easily be used as a fast-prototype platform.

The V2HBerry contains the Open Standard Module compliant System-In-Package based on Renesas' RZ/V2H Family architecture offering high-performance dual/quad CortexA55 cores in combination with a dual CortexR9 and  CortexM33 core. The MSRZV2H combines compact design and a wide range of services, bringing low power consumption, thermal efficiency and low-cost to embedded systems.

  • MSRZV2H System on Module
  • 2x Ethernet on RJ45 connector
  • PCIe on Raspberry Pi fpc-connector
  • USB Host on USB A connector
  • USB OTG interface on USB microAB connector
  • 2x USB3.2 on USB-C connector
  • display as
    • RGB display on FPC connector or
    • Display Port on Display Port connector
  • 4x cammera on fpc connectors
  • console/UART interface on USB microAB connector
  • CAN on pin header
  • SPI on pin header
  • I2C on pin header
  • GPIO on pin header
  • JTAG on pin header

V2HBerry-6DCA

  • MSRZV2H-6DCA
    • R9A09G057H48GBG RZ/V2H processor
      • 4x Cortex-A55, up to 1.8GHz
      • 2x Cortex-R9, up to 800MHz
      • 1x Cortex-M33, up to 200MHz
      • DRP AI-coprocessor
      • Security
      • ISP
    • 8GByte LPDDR4 RAM
    • 32GByte eMMC NAND Flash
    • 128Mbit SPI NOR
    • temperature range 0°C...+70°C
  • 2x Ethernet on RJ45 connector
  • PCIe on Raspberry Pi fpc-connector
  • USB Host on USB A connector
  • USB OTG interface on USB microAB connector
  • 2x USB3.2 on USB-C connector
  • display as
    • RGB display on FPC connector or
    • Display Port on Display Port connector
  • 4x cammera on fpc connectors
  • console/UART interface on USB microAB connector
  • CAN on pin header
  • SPI on pin header
  • I2C on pin header
  • GPIO on pin header
  • JTAG on pin header

OSM Standard          

OSM Standard

The idea of all Open Standard Modules (OSM) is to create a new, future proof and versatile standard for small-size, low-cost embedded computer modules, combining the following key characteristics:

  • different architectures available on the same footprint, scalability in function and performance
  • four different mechanical sizes and pin counts, downwards compatible
  • pre-defined soft- and hardware interfaces
  • specification and design guide publicly available
  • design support for baseboard integration, driver development and mass production by ARIES Embedded
  • directly assembly to the baseboard without connectors using LGA (Land Grid Array) technology
  • completely machine processible during soldering, assembly and testing

The Open Standard Module specification allows developing, producing and distributing embedded modules for the most popular MCU32, ARM and RSICV architectures. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding costs, space and interfaces.

Complex AI Applications on a Single Board