Integrated wireless with long-term availability

ARIES Embedded presents the new product based on the Qualcomm® Snapdragon™ 410E processor in the TX embedded module family. The TX embedded module integrates all the core components of a common PC and is mounted onto an application specific carrier board. TX modules have specified pinouts and provide the functional requirements for an embedded application. These functions include, but are not limited to, graphics, network and multiple USB ports. A single ruggedized SO-DIMM connector provides the carrier board interface to carry all the I/O signals to and from the TX module.

PICO-i.MX6UL for Android Things

As Google unveils its Android Things platform, the Android Things-compatible IoT development platform PICO-IMX6UL-KIT, based on the HOBBIT-board and the PICO-i.MX6UL SoM, was introduced to the market. The new Android Things Google software combined with the smart PICO-i.MX6UL SoM will accelerate product development, help companies better predict development costs, and provide Google-managed security for emerging products.

EXPRESS SHARK

The EXPRESS SHARK PCIe Expander enables user to operate PCIe devices over fiber optic cable. Any PCIe device, i.e. multimedia-, SATA- or data acquistion cards, etc., can be connected to the host via the fiber optics connections at distances up to 250 meters. No additional host software drivers are required during installation or operation, the EXPRESS SHARK PCIe Expander works out of the box.

EH-112 has dual use for your implementation:

Cooperation Development & Embedded Systems

qinno and ARIES Embedded announce their cooperation in Development and Embedded Systems.

The increasing number of different requirements in combination with complex Embedded Systems require vast efforts in hard- and software-development. The use of established and proven embedded-platforms of both companies reduces time-to-market and minimzes the amount of work to be spent on development, also for small project quantities.

Embedded World 2017

Do not miss the Embedded World 2017 in Nuremberg, March 14 - 16.

Discover the innovations from the embedded sector and meet the experts: Over 930 exhibitors and numerous speakers from 42 countries will be presenting the entire spectrum – ranging from construction elements through modules and full systems, operating systems, hard and software to services.

We will be happy to welcome you on our booth 261 in hall 3.

 

 

 

Hardware Development

Hardware Development

Hardware Development

Hardware Development

Linux builds the focus of the for hard- and software development services of ARIES Embedded. Our work helps customers saving resources and time which is essential for the implementation of ambitious projects in the world of Embedded Systems.

technology

Innovation

Our services help you to add additional expertise, focus on your competence and increase planning certainity. Make your skills more versatile.

  • expand your resources
  • increase flexibility
  • shorten time-to-market
  • reduce cost

Milestones

The fine tuned process management during the entire development project ensures that the final result will match the initial requirements.

  • starting the development process based on the requirement specification, provided by customer or engineered during a first project phase
  • dividing the schedule into milestones
  • design reviews with our customer, the approval of the review of each milestone acts as the kick-off for the subsequent milestone

Pre-Engineering

The pre-engineering work is an important phase during many development projects.  Feature distinction as well as eliminating errors during the early product definition help to develop successful and reliable products. We provide services for

  • consulting
  • feasability studies
  • concept creation

Beside the bare technical topics we provide special know-how on

  • manufacturing
  • testability
  • longevity
  • cost effectivness
  • reliability

Schematics

  • modular designs as well as custom design
  • Microcontroller-  8 to 64 Bit, Multicore,  DSP
  • ARM- Cortex-Mx/A8/A9/A15, ARM7, ARM9, ARM11, Power Architecture, MSP430, PIC, ColdFire, DSP
  • memory: SDRAM, DDR2, DDR3, Mobile DDR, Flash, HDD, SSD, eMMC,  NAND-Flash
  • interface:
    • PCIe, PCI, SATA, PS/2, USB, Firewire, PCMCIA, PCCard, J1850
    • RS232, RS422/485, CAN, DeviceNet, CAN Open, KNX, LON, Ethernet,Sercos, Powerlink, M-Bus, Profibus, Profinet, EtherCAT
  • display: LCD, VFD, STN, TFT
  • touch: resistiv, capacitive, multi-touch
  • wireless: WLAN, Bluetooth, ZigBee, GSM/GPRS, GPS
  • analogue design
  • power supply
FPGA
ETW

Layout

The heart of every electronic system consists of a well done PCB. Most modern technology is included in our layouts such as

  • HDI-/Microvia-technology for BGA/µBGA components
  • impedance controlled high speed design for modern differential memory and interface technology, i.e. DDR2, DDR3, PCI Express, RapidIO, LVDS, SATA, USB 2.0, USB 3.0 and more
  • flex / flex-rigid PCB
  • analogue design
  • 3D models, optionally including mechanical samples
  • creationof production data, PCB data and the necessary information for test equipment

Deliverables

Correct and complete deliverables are the basis for a correct, reliable and replicable product. To ensure that the product can be manufactured, maintained and improved during it entire lifetime, we provide the following deliverables:

  • CAD-data for schematics and layout
  • schematics, layout-plan, layers as pdf-files
  • production data as text files
  • Gerberdata (Extended Gerber including drill-data, PCB-datasheet and panel-drawing)

Post-Engineering

After finished the real development process still there are many tasks to be done until the final product can be marketed.  We help customers  to obtain the results of

  • design validation
  • qualification with regard to
    • EMC
    • temperature
    • mechanical shock and vibration
  • ceritifcation
  • development of test equipment
HWDS1a
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