ARIES Embedded presents the new product based on the Qualcomm® Snapdragon™ 410E processor in the TX embedded module family. The TX embedded module integrates all the core components of a common PC and is mounted onto an application specific carrier board. TX modules have specified pinouts and provide the functional requirements for an embedded application. These functions include, but are not limited to, graphics, network and multiple USB ports. A single ruggedized SO-DIMM connector provides the carrier board interface to carry all the I/O signals to and from the TX module. This SO-DIMM connector is a well known and proven high speed signal interface connector that is commonly used for memory cards in notebooks. The carrier board can provide all the interface connectors required to attach the system to the application specific peripherals.

Complex applications are driving the need for increased computing power and connectivity in new products. The TXSD is ideally suited to applications which require local processing, rapid image processing, video streaming and integrated connectivity. More information is available on the product page.